On the 17th, TSMC will hold its earnings conference, prompting a wave of speculative buying in the market. Foreign investors have been on a buying spree for five consecutive days, with purchases expanding to 14,600 lots on the 9th. A recent report from Morgan Stanley highlights that Samsung plans to outsource its HBM4 foundational technology to TSMC by 2026, stirring significant interest within the industry.
As demand for artificial intelligence (AI) computing continues to surge, memory technology has become a focal point in the global semiconductor sector, particularly high bandwidth memory (HBM), including the upcoming next-generation HBM4.
Notably, Morgan Stanley’s semiconductor analyst, Ernie Chien, points out that Samsung is expected to utilize 12nm and 6nm processes for its HBM4 foundational technology to be outsourced to TSMC by 2026.
In response to this robust demand, TSMC is actively engaged in capacity expansion, projecting its capital expenditures to reach $38 billion by 2025.
As the leader in the wafer foundry domain, TSMC is poised to achieve a technological advantage with HBM4 set to hit the market in 2025.
Recently, TSMC confirmed that it has already begun discussions with major global memory manufacturers, including SK Hynix, Samsung, and Micron, to promote the development of HBM4.
Analysts believe that with the gradual rollout of HBM4 technology, the AI industry is on the brink of a new wave of performance enhancements. This is especially critical for applications that require processing vast amounts of data, such as machine learning, AI, and high-performance computing.
Additionally, compared to memory manufacturers, TSMC possesses a strong foundation in advanced process chip manufacturing. Whether producing complete HBM chips or working on packaging with GPUs, TSMC is not only a player but also a key decision-maker, reinforcing its dominant position in the AI space.
